Cutting and Grinding
Cut single crystal ingot into square rod as required and grind all four corners with a grinding machine.
Acid Cleaning
After inspection, qualified single crystal squire rods are put into blended solution of acid in order to remove other impurities at the surface.
Gluing
Glue cleaned square rods to working plates.
Wafer Slicing
Position the squire rod onto the wire saw machine and slice the rod
into wafers according to preset configurations.
Cleaning and Ungluing
Clean the wafers to remove impurities and separate glue residuals.
Ultrasound Cleaning
Place unglued wafers into wafer boxes and process final cleaning via
ultrasound cleaning machine.
Spin Drying
Fasten the wafers boxes (with cleaned wafers) onto spin dryer and dry
the wafers through additional heater and high-speed spinning cycles.
Inspection and Packaging
Inspect wafers' appearance, thickness, resistivity, TTV, angularity and more. Classify and package the final products by different grades and shipping types.
